J. Y. Choi and M. Swaminathan, “Modeling of Multi-Layered Power/Ground Planes Using Triangle Elements,” United States Patent Application: 12/710991, filed on 2/23/2012.

K. J. Han, M. Swaminathan, "Efficient Electrical Modeling of Coupling in System-in-Package," Invention Disclosure ID: 4255, Oct. 2007, Provisional Patent Application filed by Georgia Tech

Madhavan Swaminathan, Ege Engin, Lixi Wan, Prathap Muthana"Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof", United States Patent Application: 20070120225, 5/31/2007

Madhavan Swaminathan, Ege Engin, Prathap Muthana, Krishna Srinivasan"Package having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuit and methods of forming thereof ", United States Patent Application: 20070102811, 5/10/2007

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia"Liquid crystalline polymer and multilayer polymer-based passive signal processing components for rf/wireless multi-band applications ", United States Patent Application: 20070085108, 4/19/2007

Jinwoo Choi, Madhavan Swaminathan, Vinu Govind "Mixed-signal systems with alternating impedance electromagnetic bandgap (AI-EBG) structures for noise suppression/isolation", United States Patent Application: 20060092093, 5/4/2006

Jinwoo Choi, Madhavan Swaminathan, Vinu Govind "Electromagnetic bandgap structure for isolation in mixed-signal systems ", United States Patent Application: 20060050010, 3/9/2006

George E. White, Sidharth Dalmia, Venkatesh Sundaram, Madhavan Swaminathan "Heterogeneous organic laminate stack ups for high frequency applications ", United States Patent Application: 20060017152, 1/26/2006

Vinu Govind, Sidharth Dalmia, Amit Bavisi, Venkatesh Sundraram, Madhavan Swaminathan, George White"Multi-band RF transceiver with passive reuse in organic substrates ", United States Patent Application: 20050248418, 11/10/2005

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia "Integrated passive devices fabricated utilizing multi-layer, organic laminates ", United States Patent Application: 20050231304, 10/20/2005

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia "Integrated passive devices fabricated utilizing multi-layer, organic laminates ", United States Patent Application: 20040000968, 1/1/2004

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia "Stand-alone organic-based passive devices ", United States Patent Application: 20040000701, 1/1/2004

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia "Methods for fabricating three-dimensional all organic interconnect structures ", United States Patent Application: 20040000425, 1/1/2004

Sung-Hwan Min, Madhavan Swaminathan "Efficient construction of passive macromodels for resonant networks ", United States Patent Application: 20030088394, 5/8/2003

Sidharth Dalmia, Sung Hwan Min, Seock Hee Lee, Venkatesh Sundaram, Farrokh Ayazi, George E. White, Madhavan Swaminathan, Woopoung Kim"Organic substrate having integrated passive components ", United States Patent Application: 20020158305, 10/31/2002