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Compter Aided Design Electrical-thermal co-simulation IC package/interconnects characterization Through-Silicon Vias simulation 3D multi-scale chip-package simulation EBG modeling and synthesis Modeling of coupling in 3D integration |
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RF Design System on package integration of antennas Low cost testing methodology Self healing RF components design Magnetic substrate characterization |
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High speed digital design Advanced PTL signaling DC Analysis in 3D PDN Classical SI/PI High speed I/O signaling |