Jianyong Xie, Madhavan Swaminathan"Electrical-thermal co-simulation with joule heating and convection effects for 3D systems", United States Patent: 9,037,446, 5/19/2015

Jae Young Choi, Madhavan Swaminathan"Modeling of multi-layer power/ground planes using triangle elements", United States Patent: 8,954,308, 2/10/2015

Ki Jin Han, Madhavan Swaminathan"Modeling electrical interconnections in three-dimensional structures", United States Patent: 8,352,232, 1/08/2013

George E. White, Sidharth Dalmia, Venkatesh Sundaram, Madhavan Swaminathan"Heterogeneous Organic Laminate Stack-ups for High Frequency Applications", United States Patent: 8,345,433, 1/01/2013

Krishna Bharath, Madhavan Swaminathan "Multi-layer finite element method for modeling of package power and ground planes", United States Patent: 8219377, 7/10/2012

Kim; Tae Hong (Tucker, GA), Engin; Ege (Atlanta, GA), Swaminathan; Madhavan (Marietta, GA), "Systems and methods for electromagnetic band gap structure synthesis", US Patent: 8,060,457, Issue date: Nov 15, 2011

George E. White, Madhavan Swaminathan, Venkatesh Sundaram and Sidharth Dalmia, "Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications", US Patent: 8,013,688, September 6, 2011.

Raj Pulugurtha, Jin Hyun Hwang, Isaac Robin Abothu, Mahadevan Krishna Iyer, Rao Tummala and Madhavan Swaminathan, “Ferroelectrics and Ferromagnetics for Noise Isolation in Integrated Circuits, Packaging and System Architetures”, United States Patent 7,977,758, Issue Date: 7/12/11.

Ege Engin, Madhavan Swaminathan, "Multilayer finite difference methods for electrical modeling of packages and printed circuit boards," United States Patent 7895540, 2/22/11.

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia, "Method for fabricating three-dimensional all organic interconnect structures," United States Patent 7805834, 10/5/10.

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia, "Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications," United States Patent 7795995, 9/14/10.

Madhavan Swaminathan, Ege Engin, Prathap Muthana, Krishna Srinivasan, "Device having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry of an integrated circuit," United States Patent 7705423, 4/27/10.

Madhavan Swaminathan, Ege Engin, Lixi Wan, and Prathap Muthana, "Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof," United States Patent: 7504706, 3/17/09.

Vinu Govind, Sidharth Dalmia, Amit Bavisi, Venkatesh Sundaram, Madhavan Swaminathan and George White,"Multi-band RF transceiver with passive reuse in organic substrates," United States Patent: 7489914, 2/10/09

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia "Methods for fabricating three-dimensional all organic interconnect structures ", United States Patent: 7260890, 8/28/2007

Jinwoo Choi, Madhavan Swaminathan, Vinu Govind "Mixed-signal systems with alternating impedance electromagnetic bandgap (AI-EBG) structures for noise suppression/isolation ", United States Patent: 7253788, 8/7/2007

Jinwoo Choi, Madhavan Swaminathan, Vinu Govind "Electromagnetic bandgap structure for isolation in mixed-signal systems ", United States Patent: 7215301, 5/8/2007

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia "Integrated passive devices fabricated utilizing multi-layer, organic laminates ", United States Patent: 7068124, 6/27/2006

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia "Stand-alone organic-based passive devices ", United States Patent: 6987307, 1/17/2006

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia "Integrated passive devices fabricated utilizing multi-layer, organic laminates ", United States Patent: 6900708, 5/31/2005

Laertis Economikos, Mukta Shaji Farooq, Michael Ford McAllister, Eric Daniel Perfecto, Chandrika Prasad, Keshav Prasad, Madhavan Swaminathan, Thomas Anthony Wassick, George White"Thin film wiring scheme utilizing inter-chip site surface wirin", United States Patent: 6444919, 9/3/2002

Abijit Chatterjee, Bruce Kim, Madhavan Swaminathan "System, circuit, and method for testing an interconnect in a multi-chip substrate", United States Patent: 6111414, 8/29/2000

Eric Daniel Perfecto, Chandrika Prasad, Keshav Prasad, Gordon Jay Robbins, Madhavan Swaminathan, George Eugene White"Minimal capture pads applied to ceramic vias in ceramic substrates ", United States Patent: 5916451, 6/29/1999

Michael Ford McAllister, James Alexander McDonald, Gordon Jay Robbins, Madhavan Swaminathan, Gregory Martine Wilkins"Method of constructing an integrated circuit memory ", United States Patent: 5817543, 10/6/1998

Michael McAllister, James McDonald, Eric Daniel Perfecto, Chandrika Prasad, Keshav Prasad, Gordon J. Robbins, Madhavan Swaminathan, George Eugene White"Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure ", United States Patent: 5757079, 5/26/1998

Michael McAllister, Eric Daniel Perfecto, James McDonald, Keshav Prasad, Gordon J. Robbins, Chandrika Prasad, Madhavan Swaminathan, George Eugene White"Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages ", United States Patent: 5747095, 5/5/1998

Michael F. McAllister, James A. McDonald, Gordon J. Robbins, Madhavan Swaminathan, Gregory M. Wilkins"High density memory structure ", United States Patent: 5523619, 6/4/1996

Eric D. Perfecto, Chandrika Prasad, Keshav Prasad, Gordon J. Robbins, Madhavan Swaminathan, George E. White "Minimal capture pads applied to ceramic vias in ceramic substrates ", United States Patent: 5464682, 11/7/1995

Michael F. McAllister, James A. McDonald, Keshav Prasad, Gordon J. Robbins, Madhavan Swaminathan "Thin-film wiring layout for a non-planar thin-film structure ", United States Patent: 5378927, 1/3/1995