Srinivasan, K.; Yadav, P.; Engin, A.E.; Swaminathan, M.; Ha, Myunghyun; "Fast EM/Circuit Transient Simulation Using Laguerre Equivalent Circuit (SLeEC), "Electromagnetic Compatibility, IEEE Transactions on Volume 51, Issue 3, Part 2, Aug. 2009 Page(s):756 - 762 (PDF)

Ha, M.; Srinivasan, K.; Swaminathan, M.; "Transient Chip-Package Cosimulation of Multiscale Structures Using the Laguerre-FDTD Scheme, "Advanced Packaging, IEEE Transactions on, Volume 32, Issue 4, Nov. 2009 Page(s):816 - 830 (PDF)

Altunyurt, N.; Rieske, R.; Swaminathan, M.; Sundaram, V.; "Conformal Antennas on Liquid Crystalline Polymer Based Rigid-Flex Substrates Integrated With the Front-End Module, "Advanced Packaging, IEEE Transactions on, Volume 32, Issue 4, Nov. 2009 Page(s):797 - 808 (PDF)

Bernie Jord Yang and Madhavan Swaminathan; "Simple Equivalent Circuit Model of a Stripline in Inhomogeneous Dielectric Media,"accepted and to be published in IEEE Microwave and Wireless Component Letters, Dec. 2009

K. J. Han and M. Swaminathan; "Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions, "IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 28, no. 6, pp. 846-859, Jun. 2009. (PDF)

T. H. Kim; M. Swaminathan, A. E. Engin and B. J. Yang,; "Electromagnetic Band Gap Synthesis Using Genetic Algorithms for Mixed Signal Applications, "IEEE Transactions on Advanced Packaging, Vol. 32, Issue 1, pp. 13-25, Feb. 2009. (PDF)

Seunghyun Hwang, S. H. Min, M. Swaminathan; "Characterization of Next Generation Thin Low-K and Low-Loss Organic Dielectrics from 1 to 110 GHz, " IEEE Transactions on Advanced Packaging, vol. 33, no. 1, pp. 180-188, Aug. 2009. (PDF)

J. Choi, V. Govind, K. Bharath and M. Swaminathan; "Noise Isolation in Mixed-Signal Systems Using AlternatingImpedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN), " Accepted for publication in Transactions in Advanced Packaging, 2009.

K. Bharath and M. Swaminathan; "Multi-Layer Fringe-Field Augmentations for the Modeling of Package Power Planes using the Finite Difference Method, " Accepted for publication in IEEE Transactions on Advanced Packaging, 2009.

Ki Jin Han, Madhavan Swaminathan, and Tapobrata Bandyopadhyay; "Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis Functions, " Accepted to the Transactions on Advanced Packaging, Special Issue, 2009.