Jianyong Xie, D. Chung, M. Swaminathan, M. Mcallister, A. Deutsch, L. Jiang, B. J Rubin; "Electrical-thermal co-analysis for power delivery networks in 3D system integration," IEEE International Conference on 3D System Integration (3DIC), Sept. 2009. (PDF)

Jianyong Xie, D. Chung, M. Swaminathan, M. Mcallister, A. Deutsch, L. Jiang, B. J Rubin; "Effect of System Components on Electrical and Thermal Characteristics for Power Delivery Networks in 3D System Integration,"18th conference on Electrical Performance of Electronic Packaging and Systems, Oct. 2009. (PDF)

Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung, Madhavan Swaminathan, Rao Tummala; "Electrical Modeling of Annular and Co-axial TSVs Considering MOS Capacitance Effects,"IEEE Electrical Performance of Electronic Packaging and Systems Conference (EPEPS). Portland, OR. October 2009. (PDF)

Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung, Madhavan Swaminathan, Rao Tummala; "Electrical Modeling of Through Silicon and Package Vias,"IEEE International Conference on 3D System Integration (3D IC). San Francisco, CA. September 2009. (PDF)

Bharath, K.; Jae Young Choi; Swaminathan, M.; "Use of Finite Element Method for Modeling of Multi-Layered Power Ground Planes with Small Features,"Electronic Components and Technology Conference, 2009. ECTC 2009. 59th 26-29 May 2009 Page(s):1630 - 1635 (PDF)

Nevin Altunyurt, Madhavan Swaminathan, Pulugurtha Markondeya Raj, Vijay Nair; "Analysis on the miniaturization of reactive impedance surfaces with magneto-dielectrics,"IEEE Antennas and Propagation International Symposium, June1-5, 2009. (PDF)

Nevin Altunyurt, Madhavan Swaminathan, Pulugurtha Markondeya Raj, Vijay Nair; "Antenna miniaturization using magneto-dielectric substrates,"Electronic Components and Technology Conference, May 26-29, 2009. (PDF)

Suzanne Huh, Daehyun Chung and Madhavan Swaminathan; "Achieving Near Zero SSN Power Delivery Networks by Eliminating Power Planes and Using Constant Current Power Transmission Lines,"18th conference on Electrical Performance of Electronic Packaging and Systems, Oct. 2009. (PDF)

Narayanan T.V., Sung-Hwan Min, Madhavan Swaminathan; "Accelerated Frequency Domain Analysis by Susceptance-Element Based Model Order Reduction of 3D Full-wave Equations,"18th conference on Electrical Performance of Electronic Packaging and Systems, Oct. 2009. (PDF)

Narayanan T.V. , Krishna Srinivasan, Madhavan Swaminathan; "Fast Memory-Efficient Full-Wave 3D Simulation of Power Planes,"Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on 17-21 Aug. 2009 Page(s):262 - 267 (PDF)

Suzanne Huh, Daehyun Chung and Madhavan Swaminathan; "Achieving near zero SSN power delivery networks by eliminating power planes and using constant current power transmission lines,"Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on,19-21 Oct. 2009 Page(s):17 - 20 (PDF)

Rao Tummala, Venky Sundaram, Ritwik Chatterjee, P. Markodeya Raj, Nitesh Kumbhat, Vijay Sukumaran, Vivek Sridharan, Abhishek Choudury, Qiao Chen, Tapobrata Bandyopadhyay; "Trend from ICs to 3D ICs to 3D Systems,"IEEE Custom Integrated Circuits Conference (CICC), San Jose, CA. September 2009. (PDF)

Tapobrata Bandyopadhyay, Lei Shan, Young Kwark, XiaoXiong Gu, Mark Ritter, Christian Baks, Richard John, Rao Tummala; "A Study on Crosstalk Analysis in Aggregative Transmission Lines with Turning Vias,"IEEE ECTC Conference. San Diego, CA. May 2009. (PDF)

Suzanne Huh, Daehyun Chung and Madhavan Swaminathan; "Near Zero SSN Power Delivery Networks Using Constant Voltage Power Transmission Lines,"IEEE Electrical Design of Advanced Packaging & Systems Symposium, Dec. 2009

Sunghwan Min, Seunghyun Hwang, M. Swaminathan; "Filter integration on ultra thin organic substrate via 3d stitched capacitor,"IEEE Electrical Design of Advanced Packaging and Systems Symposium, Dec. 2009. (PDF)

K. J. Han and M. Swaminathan; "Polarization Mode Basis Functions for Modeling Insulator-Coated Through-Silicon Via (TSV) Interconnections,"IEEE Workshop on Signal Propagation on Interconnects (SPI), May 2009 (PDF)