| Members | Past Post Docs and Visiting Scholars | Graduated Students | Past Undegraduate Students |
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David Zhang, PhD 2016 Sandisk Thesis: Design of Power Delivery Networks Using Power Transmission Lines for High Speed I/O signaling in Complex Electronic Systems(PDF) |
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Sung Joo Park, PhD 2016 Samsung Thesis: Managing signal, power, and thermal integrity for three-dimensional integrated circuits and systems(PDF) |
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Kyuhwan Han, PhD 2015 Viasat Thesis: Magneto-dielectric Material Characterization and RF Antenna Design(PDF) |
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Ming Yi, PhD 2015 Qualcomm Thesis: Transient Simulation for Multiscale Chip-Package Structures Using the Laguerre-FDTD Scheme(PDF) |
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Satyan Telikepalli, PhD 2014 Qualcomm Thesis: Managing Signal and Power Integrity Using Power Transmission Lines and Alternate Signaling Schemes(PDF) |
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Biancun Xie, PhD 2014 Intel Thesis: Modeling and Simulation of Silicon Interposers for 3-D Integrated Systems(PDF) |
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Stephen Dumas, MS 2014 |
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Nitish Natu, MS 2013, Cypress Semiconductor Corp. Thesis: Design and Prototyping of Temperature Resilient Clock Distribution Networks (PDF) |
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Jianyong Xie, PhD 2013, Intel Corporation Thesis: Electrical-Thermal Modeling and Simulation for Three-Dimensional Integrated Systems(PDF) |
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Rishik Bazaz, MS 2012, Intel Corporation Thesis: Design Exchange Formats for Assessing Ohmic Drops and Thermal Profiles in Three Dimensional Integrated Circuits(PDF) |
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Jae Young Choi, PhD 2012, Oracle Corporation Thesis: Modeling and Simulation for Signal and Power Integrity of Electronic Packages(PDF) |
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Myunghyun Ha, PhD 2011, Intel Corporation Thesis: EM Simulation using the Laguerre-FDTD Scheme for Multiscale 3-D Interconnections(PDF) |
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Suzanne Huh, PhD 2011, Intel Corporation Thesis: Design of Power Delivery Networks For Noise Suppression and Isolation Using Power Transmission Lines(PDF) |
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Tapobrata Bandyopadhyay, PhD 2011, Texas Intruments Thesis: Modeling, Design, and Characterization of Through Vias in silicon and Glass Interposers(PDF) |
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Seunghyun Eddy Hwang, PhD 2011, NVIDIA Corporation Thesis: Characterizaion and Design of Embedded Passive Circuits for Applications up to Millimeter-wave Frequency(PDF) |
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Narayanan T.V., PhD 2011, Intel Corporation Thesis: Fast Methods for Full-wave Electromagnetic Simulations of Integrated Circuit Package Modules(PDF) |
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Nithya Sankaran, PhD 2011, NVDIA Corporation Thesis: Electromagnetic Coupling in Multilayer Thin-flim Organic Packages with Chip-last Embedded Actives(PDF) |
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Abhilash Goyal, PhD 2011, Oracle Corporation Thesis: Methodologies for Low-Cost Testing and Self-Healing of RF Systems(PDF) |
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Nevin Altunyurt, PhD 2010, Intel Corporation Thesis: Integration and Miniaturization of Antennas for System-On-Package Applications(PDF) |
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Ki Jin Han, PhD 2009, IBM Corporation Thesis: Electromagnetic Modeling of Interconnections in Three-Dimensional Integration(PDF) |
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Krishna Bharath, PhD 2009, Intel Corporation Thesis: Signal and Power Integrity Co-simulation using the Multi-Layer Finite Difference Method(PDF) |
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Aswani Kurra, MS 2009, LSI Corporation |
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Sukruth G Pattanagiri, MS 2009, Analog Devices, Inc |
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Vishal Laddha, MS 2009, NVIDIA Corporation Thesis: Correlation of PDN Impedance with Jitter and Voltage Margin in High Speed Channels(PDF) |
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Ranjeeth Doppalapudi, MS 2009 Thesis: Design for manufacturability for system in package applications(PDF) |
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Janani Chandrasekhar, MS 2008, NVIDIA Corporation Thesis: Signal to Power Coupling and Noise Induced Jitter in Differential Signaling(PDF) |
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Krishna Srinivasan, PhD 2008, Intel Corporation Thesis: Multiscale EM and Circuit Simulation Using the Laguerre-FDTD Scheme for Package-Aware Integrated-Circuit Design(PDF) |
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Subramanian N Lalgudi, PhD 2008, Ansoft Corporation Thesis: Transient Simulation of Power-Supply Noise in Irregular On-Chip Power Distribution Networks Using Latency Insertion Method, and Causal Transient Simulation of Interconnects Characterized by Band-Limited Data and Terminated by Arbitrary Terminatinos (PDF) |
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Tae Hong Kim, PhD 2008, IBM Corporation Thesis: Electromagnetic Band Gap (EBG) Synthesis and Its Application in Analog-to-Digital Converter Load (PDF) |
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Wansuk Yun, PhD 2007, Broadcom Corporation Thesis: Design,Modeling, and Characterization of Embedded Passives and interconnects in Inhomogeneous Liquid Crystalline Polymer (LCP) Substrates (PDF) |
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Marie-Solange Milleron, MS 2007, Qualcomm |
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Abdemanaf Tambawala, MS 2007, Cisco Systems |
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Souvik Mukherjee, PhD 2007, Texas Instruments Thesis: Layout-level Circuit Sizing and Design-for-manufacturability Methods for Embedded RF Passive Circuits (PDF) |
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Prathap Muthana, PhD 2007, NVIDIA Corporation Thesis: Design of High Speed Packages and Boards Using Embedded Decoupling Capacitors (PDF) |
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Amit Bavisi, PhD 2006, IBM Corporation Thesis: Integrated multi-mode oscillators and filters for multi-band radios using liquid crystalline polymer based packaging technology (PDF) |
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Rohan Mandrekar, PhD 2006, IBM Corporation Thesis: Modeling and Co-simulation of Signal Distribution and Power Delivery in Packaged Digital Systems (PDF) |
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Jinwoo Choi, PhD 2005, IBM Corporation Thesis: Noise Suppression and Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure (PDF) |
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Bhyrav Mutnury, PhD 2005, IBM Corporation Thesis: Macromodeling of Nonlinear Driver and Receiver Circuits (PDF) |
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Vinu Govind, PhD 2005, Jacket Micro Devices Thesis: Design of Baluns and Low Noise Amplifiers in Integrated Mixed-Signal Organic Substrates (PDF) |
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Martin Saint-Laurent, PhD 2005, Design Engineer, Intel Corporation Thesis: Modeling and Analysis of High-Frequency Microprocessor Clocking Networks (PDF) |
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Jifeng Mao, PhD 2004, Optimal Corp. Thesis: Modeling of Simultaneous Switching Noise in On-Chip and Package Power Distribution Networks Using Conformal Mapping, Finite Difference Time Domain and Cavity Resonator Methods (PDF) |
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Sung Hwan Min, PhD 2004, Jacket Micro Devices Thesis: Automated Construction of Macromodels from Frequency Data for Simulation of Distributed Interconnect Networks (PDF) |
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Woopoung Kim, PhD 2004, Texas Instruments Thesis: Development of Measurement-based Time-domain Models and its Application to Wafer Level Packaging(PDF) |
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Raghavan Madhavan, MS 2004, Qualcomm |
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Di Qian, MS 2004, Johns Hopkins University |
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Erdem Matoglu, PhD 2003, IBM Corp Thesis: Statistical design, analysis, and diagnosis of digital systems and embedded RF circuits (PDF) |
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Jinseong Choi, PhD 2002, Advanced Micro Devices Thesis: Modeling of Power Supply Noise in Large Chips using the Finite Difference Time Domain Method (PDF) |
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Joong-Ho Kim, PhD 2002, Rambus Corp Thesis: Modeling of Package and Board Power Distribution Networks Using Transmission Matrix and Macro-modeling Methods (PDF) |
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Sidharth Dalmia, PhD 2002, Jacket Micro Devices Inc Thesis: Design and Implementation of High-Q Passive Devices for Wireless Applications using System-on-Package (SOP) based Organic Methodologies (PDF) |
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Sungjun Chun, PhD 2002, IBM Corporation Thesis: Methodologies for Modeling Simultaneous Switching Noise in Multi-Layered Packages and Boards (PDF) |
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Nanju Na, PhD 2001, IBM Corporation Thesis: Modeling and Simulation of Planes in Electronic Packages (PDF) |
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Sreemala Pannala, PhD 1999, Sun Microsystems Thesis: Development of Time Domain Characterization Methods for Packaging Strucutres (PDF) |
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Kwang Choi, PhD 1999, Intel Corporation
Thesis: Modeling and Simulation of Embedded Passives Using Rational Functions in Mult-layered Substrates (PDF) |
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Raj Subramanian, MS 1999, IBM Corporation |
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Albert Baldisserotto, MS 1999 |
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Anisha Sood, MS 1999, Raytheon Corporation |
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Jaya Bandyopadyay, MS 1998, Sun Microsystems |
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Anand Haridass, MS 1997, IBM Corporation |
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Kumaresh Bathey, MS 1996, IBM Corporation |
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Joshua LeVasseur, BS 1996, Intel Corporation |