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David Zhang, PhD 2016 Sandisk
Thesis:
Design of Power Delivery Networks Using Power Transmission Lines for High Speed I/O signaling in Complex Electronic Systems(PDF)
Sung Joo Park, PhD 2016 Samsung
Thesis:
Managing signal, power, and thermal integrity for three-dimensional integrated circuits and systems(PDF)
Kyuhwan Han, PhD 2015 Viasat
Thesis:
Magneto-dielectric Material Characterization and RF Antenna Design(PDF)
Ming Yi, PhD 2015 Qualcomm
Thesis:
Transient Simulation for Multiscale Chip-Package Structures Using the Laguerre-FDTD Scheme(PDF)
Satyan Satyan Telikepalli, PhD 2014 Qualcomm
Thesis:
Managing Signal and Power Integrity Using Power Transmission Lines and Alternate Signaling Schemes(PDF)
Biancun Biancun Xie, PhD 2014 Intel
Thesis:
Modeling and Simulation of Silicon Interposers for 3-D Integrated Systems(PDF)
Stephen Stephen Dumas, MS 2014
Nitish Nitish Natu, MS 2013, Cypress Semiconductor Corp.
Thesis:
Design and Prototyping of Temperature Resilient Clock Distribution Networks (PDF)
Jianyong Jianyong Xie, PhD 2013, Intel Corporation
Thesis:
Electrical-Thermal Modeling and Simulation for Three-Dimensional Integrated Systems(PDF)
Rishik Rishik Bazaz, MS 2012, Intel Corporation
Thesis:
Design Exchange Formats for Assessing Ohmic Drops and Thermal Profiles in Three Dimensional Integrated Circuits(PDF)
Jae Young Jae Young Choi, PhD 2012, Oracle Corporation
Thesis:
Modeling and Simulation for Signal and Power Integrity of Electronic Packages(PDF)
Myunghyun Myunghyun Ha, PhD 2011, Intel Corporation
Thesis:
EM Simulation using the Laguerre-FDTD Scheme for Multiscale 3-D Interconnections(PDF)
Suzanne Suzanne Huh, PhD 2011, Intel Corporation
Thesis:
Design of Power Delivery Networks For Noise Suppression and Isolation Using Power Transmission Lines(PDF)
Seunghyun Tapobrata Bandyopadhyay, PhD 2011, Texas Intruments
Thesis:
Modeling, Design, and Characterization of Through Vias in silicon and Glass Interposers(PDF)
Seunghyun Seunghyun Eddy Hwang, PhD 2011, NVIDIA Corporation
Thesis:
Characterizaion and Design of Embedded Passive Circuits for Applications up to Millimeter-wave Frequency(PDF)
Narayanan Narayanan T.V., PhD 2011, Intel Corporation
Thesis:
Fast Methods for Full-wave Electromagnetic Simulations of Integrated Circuit Package Modules(PDF)
Nithya Nithya Sankaran, PhD 2011, NVDIA Corporation
Thesis:
Electromagnetic Coupling in Multilayer Thin-flim Organic Packages with Chip-last Embedded Actives(PDF)
Abhilash Abhilash Goyal, PhD 2011, Oracle Corporation
Thesis:
Methodologies for Low-Cost Testing and Self-Healing of RF Systems(PDF)
Nevin Nevin Altunyurt, PhD 2010, Intel Corporation
Thesis:
Integration and Miniaturization of Antennas for System-On-Package Applications(PDF)
Ki Jin Ki Jin Han, PhD 2009, IBM Corporation
Thesis:
Electromagnetic Modeling of Interconnections in Three-Dimensional Integration(PDF)
Krishna Krishna Bharath, PhD 2009, Intel Corporation
Thesis:
Signal and Power Integrity Co-simulation using the Multi-Layer Finite Difference Method(PDF)
Aswani Aswani Kurra, MS 2009, LSI Corporation
Sukruth Sukruth G Pattanagiri, MS 2009, Analog Devices, Inc
Vishal Vishal Laddha, MS 2009, NVIDIA Corporation
Thesis:
Correlation of PDN Impedance with Jitter and Voltage Margin in High Speed Channels(PDF)
Ranjeeth Ranjeeth Doppalapudi, MS 2009
Thesis:
Design for manufacturability for system in package applications(PDF)
Janani Chandrasekhar Janani Chandrasekhar, MS 2008, NVIDIA Corporation
Thesis:
Signal to Power Coupling and Noise Induced Jitter in Differential Signaling(PDF)
Krishna Srinivasan Krishna Srinivasan, PhD 2008, Intel Corporation
Thesis:
Multiscale EM and Circuit Simulation Using the Laguerre-FDTD Scheme for Package-Aware Integrated-Circuit Design(PDF)
Subramanian N Lalgudi Subramanian N Lalgudi, PhD 2008, Ansoft Corporation
Thesis:
Transient Simulation of Power-Supply Noise in Irregular On-Chip Power Distribution Networks Using Latency Insertion Method, and Causal Transient Simulation of Interconnects Characterized by Band-Limited Data and Terminated by Arbitrary Terminatinos (PDF)
taehong Tae Hong Kim, PhD 2008, IBM Corporation
Thesis:
Electromagnetic Band Gap (EBG) Synthesis and Its Application in Analog-to-Digital Converter Load (PDF)
wansuk Wansuk Yun, PhD 2007, Broadcom Corporation
Thesis:
Design,Modeling, and Characterization of Embedded Passives and interconnects in Inhomogeneous Liquid Crystalline Polymer (LCP) Substrates (PDF)
souvik Marie-Solange Milleron, MS 2007, Qualcomm
souvik Abdemanaf Tambawala, MS 2007, Cisco Systems
souvik Souvik Mukherjee, PhD 2007, Texas Instruments
Thesis:
Layout-level Circuit Sizing and Design-for-manufacturability Methods for Embedded RF Passive Circuits (PDF)
muthana Prathap Muthana, PhD 2007, NVIDIA Corporation
Thesis:
Design of High Speed Packages and Boards Using Embedded Decoupling Capacitors (PDF)
Amit Bavisi, PhD 2006, IBM Corporation
Thesis:
Integrated multi-mode oscillators and filters for multi-band radios using liquid crystalline polymer based packaging technology (PDF)
Rohan Mandrekar, PhD 2006, IBM Corporation
Thesis:
Modeling and Co-simulation of Signal Distribution and Power Delivery in Packaged Digital Systems (PDF)
Jinwoo Choi, PhD 2005, IBM Corporation
Thesis:
Noise Suppression and Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure (PDF)
Bhyrav Mutnury, PhD 2005, IBM Corporation
Thesis:
Macromodeling of Nonlinear Driver and Receiver Circuits (PDF)
Vinu Govind, PhD 2005, Jacket Micro Devices
Thesis:
Design of Baluns and Low Noise Amplifiers in Integrated Mixed-Signal Organic Substrates (PDF)
Martin Saint-Laurent, PhD 2005, Design Engineer, Intel Corporation
Thesis:
Modeling and Analysis of High-Frequency Microprocessor Clocking Networks (PDF)
Jifeng Mao, PhD 2004, Optimal Corp.
Thesis:
Modeling of Simultaneous Switching Noise in On-Chip and Package Power Distribution Networks Using Conformal Mapping, Finite Difference Time Domain and Cavity Resonator Methods (PDF)
Sung Hwan Min, PhD 2004, Jacket Micro Devices
Thesis:
 Automated Construction of Macromodels from Frequency Data for Simulation of Distributed Interconnect Networks (PDF)
Woopoung Kim, PhD 2004, Texas Instruments
Thesis: Development of Measurement-based Time-domain Models and its Application to Wafer Level Packaging(PDF)
Raghavan Madhavan, MS 2004, Qualcomm
Di Qian, MS 2004, Johns Hopkins University
Erdem Matoglu, PhD 2003, IBM Corp
Thesis:
Statistical design, analysis, and diagnosis of digital systems and embedded RF circuits (PDF)
Jinseong Choi, PhD 2002, Advanced Micro Devices
Thesis: Modeling of Power Supply Noise in Large Chips using the Finite Difference Time Domain Method (PDF)
Joong-Ho Kim, PhD 2002, Rambus Corp
Thesis:
 Modeling of Package and Board Power Distribution Networks Using Transmission
Matrix and Macro-modeling Methods (PDF)
Sidharth Dalmia, PhD 2002, Jacket Micro Devices Inc
Thesis: Design and Implementation of High-Q Passive Devices for Wireless Applications using System-on-Package (SOP) based Organic Methodologies (PDF)
Sungjun Chun, PhD 2002, IBM Corporation
Thesis:
 Methodologies for Modeling Simultaneous Switching Noise in Multi-Layered
Packages and Boards (PDF)
Nanju Na, PhD 2001, IBM Corporation
Thesis: Modeling and Simulation of Planes in Electronic Packages (PDF)
Sreemala Pannala, PhD 1999, Sun Microsystems
Thesis:
 Development of Time Domain Characterization Methods for Packaging
Strucutres (PDF)
Kwang Choi, PhD 1999, Intel Corporation  
Thesis: Modeling and Simulation of Embedded Passives Using Rational Functions in Mult-layered Substrates (PDF)
Raj Subramanian, MS 1999, IBM Corporation
Albert Baldisserotto, MS 1999  
Anisha Sood, MS 1999, Raytheon Corporation
Jaya Bandyopadyay, MS 1998, Sun Microsystems
Anand Haridass, MS 1997, IBM Corporation
Kumaresh Bathey, MS 1996, IBM Corporation
Joshua LeVasseur, BS 1996, Intel Corporation